Author | Mark S. Shephard, Ting-Leung Sham, L.-Y. Song, Vincent S. Wong, Rao Garimella, Harry F. Tiersten, B.J. Lwo, Yannick LeCoz, and Ralph B. Iverson |
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Title | Global/Local Analyses of Multichip Modules: Automated 3-D Model Construction and Adaptive Finite Element Analysis |
Year | 1993 |
Pages | 39-48 |
Editor | - - |
Abstract | The effective design of a multilayer multichip module must account for its thermo-mechanical response to ensure the integrity of the device. To address this need a set of global/local analysis procedures capable of effectively performing heat conduction and thermomechanical analysis are required. This paper will first overview an overall approach being taken in the development of a set of such procedures. Attention will then focus on the automatic construction, and adaptive finite element analysis of critical local 3-D regions. |