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Author T. S. Cale, T. P. Merchant and L. J. Borucki
TitleThe Roles of "3d/2d" and "3d/3d" Topography Simulators in Process Development: Model Development and Process Integration
Year1999
JournalAdvanced Metallization Conference in 1998
Volume1998
Pages737-741
PublisherMaterials Research Society
EditorG. S. Sandhu, H. Koerner, M. Murakami, Y. Yasuda and N. Kobayashi
AbstractTransport and reaction submodels needed for physics-based process simulations will continue to be developed using experiments performed on structures that are 2d, combined with three dimensional 3d transport simulations; i.e., "3d/2d" simulations. Three dimensional device structures will be generated using "3d/3d" topography simulations, using algorithms that emphasize robustness. We present two case studies to demonstrate the roles of 3d/2d and 3d/3d simulations. First, we discuss plasma enhanced deposition of silicon dioxide from TEOS, as an example of how 3d/2d and 3d/3d simulations are used together. Then, we discuss a process integration study to emphasize the important role that 3d/2d simulations will continue to play.